Invention Grant
- Patent Title: Audio device mount assembly
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Application No.: US16778125Application Date: 2020-01-31
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Publication No.: US10979791B2Publication Date: 2021-04-13
- Inventor: Vincent William Ellis , William John Done
- Applicant: Biamp Systems, LLC
- Applicant Address: US OR Beaverton
- Assignee: Biamp Systems, LLC
- Current Assignee: Biamp Systems, LLC
- Current Assignee Address: US OR Beaverton
- Main IPC: H04R1/02
- IPC: H04R1/02

Abstract:
Example embodiments provide a device that includes a support plate having a flat base portion and an elongated portion which extends perpendicular to the flat base portion, and a housing embodying one or more of a microphone and a speaker, and a housing backside having a set of screw holes configured to receive a set of screws to secure the support plate flat base portion to be flush mounted against the housing.
Public/Granted literature
- US20200252703A1 AUDIO DEVICE MOUNT ASSEMBLY Public/Granted day:2020-08-06
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