Multiple resin over-mold for printed circuit board electronics and light guide
摘要:
A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the light emitting diode and fills the through aperture and covers substantially all of the first face positioned outside of the space envelope containing the connector.
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