- 专利标题: Multiple resin over-mold for printed circuit board electronics and light guide
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申请号: US15976110申请日: 2018-05-10
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公开(公告)号: US10939544B2公开(公告)日: 2021-03-02
- 发明人: Ron G. Gipson , Bhanumurthy Veeragandham , Indraneel Page
- 申请人: Dura Operating, LLC
- 申请人地址: US MI Auburn Hills
- 专利权人: Dura Operating, LLC
- 当前专利权人: Dura Operating, LLC
- 当前专利权人地址: US MI Auburn Hills
- 代理机构: Vivacqua Crane
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/18 ; H05K3/28
摘要:
A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the light emitting diode and fills the through aperture and covers substantially all of the first face positioned outside of the space envelope containing the connector.
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