- 专利标题： Circuit board structure
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申请号： US16907298申请日： 2020-06-21
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公开(公告)号： US10939538B1公开(公告)日： 2021-03-02
- 发明人: Ming-Hao Wu , Shao-Chien Lee
- 申请人： Unimicron Technology Corp.
- 申请人地址： TW Taoyuan
- 专利权人： Unimicron Technology Corp.
- 当前专利权人： Unimicron Technology Corp.
- 当前专利权人地址： TW Taoyuan
- 代理机构： JCIPRNET
- 优先权： TW109113855 20200424
- 主分类号： H05K1/02
- IPC分类号： H05K1/02
摘要：
A circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has two opposite surfaces. A metal layer is disposed on each of the opposite surfaces of the circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.
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