- 专利标题: Semiconductor device and manufacturing method thereof
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申请号: US16195680申请日: 2018-11-19
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公开(公告)号: US10937879B2公开(公告)日: 2021-03-02
- 发明人: Meng-Han Lin , Wei-Cheng Wu , Te-Hsin Chiu
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Maschoff Brennan
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/423 ; H01L29/792 ; H01L21/02 ; H01L27/11573 ; H01L21/28 ; H01L27/1157
摘要:
A semiconductor device includes a semiconductor substrate, a control gate, a select gate, a charge trapping structure, and a dielectric structure. The semiconductor substrate has a drain region, a source region, and a channel region between the drain region and the source region. The control gate is over the channel region of the semiconductor substrate. The select gate is over the channel region of the semiconductor substrate and separated from the control gate. The charge trapping structure is between the control gate and the semiconductor substrate. The dielectric structure is between the select gate and the semiconductor substrate. The dielectric structure has a first part and a second part, the first part is between the charge trapping structure and the second part, and the second part is thicker than the first part.
公开/授权文献
- US20190165115A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2019-05-30
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