- 专利标题： Image module package having flat glass filter flush with transparent layer
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申请号： US16235118申请日： 2018-12-28
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公开(公告)号： US10937773B2公开(公告)日： 2021-03-02
- 发明人: Chee-Pin T'ng , Sai-Mun Lee
- 申请人： PixArt Imaging Inc.
- 申请人地址： TW Hsin-Chu County
- 专利权人： PixArt Imaging Inc.
- 当前专利权人： PixArt Imaging Inc.
- 当前专利权人地址： TW Hsin-Chu County
- 代理机构： Hauptman Ham, LLP
- 主分类号： H01L25/16
- IPC分类号： H01L25/16 ; G01S17/04 ; G01J1/02 ; G01S7/481 ; G01J3/02 ; G01J3/10 ; H01L25/00
摘要：
There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
公开/授权文献
- US20190139951A1 IMAGE MODULE PACKAGE 公开/授权日：2019-05-09
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