- 专利标题： Package and manufacturing method thereof
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申请号： US16739053申请日： 2020-01-09
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公开(公告)号： US10937742B2公开(公告)日： 2021-03-02
- 发明人: Po-Hao Tsai
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L25/065 ; H01L25/00 ; H01L23/31 ; H01L23/498 ; H01L21/56 ; H01L23/16 ; H01L21/683
摘要：
A package includes a plurality of dies, a wall structure, an encapsulant, and a redistribution structure. The wall structure surrounds at least one of the dies. The encapsulant includes a first portion, a second portion, and a third portion. The first portion is encircled by the wall structure. The second portion encircles the wall structure. The third portion connects the first portion and the second portion. The redistribution structure is disposed on the encapsulant and is electrically connected to the dies and the wall structure.
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