A conductor shaping apparatus includes a driving device that relatively rotates an upper die and a lower die and integrally rotates the two dies with respect to a shaping member. The driving device rotates one of the upper and lower dies in a direction from an edgewise bent portion to a distal end of a conductor. One of the upper and lower dies includes a supporting surface configured to support a side surface of an end portion of the conductor as the edgewise bent portion is formed in the end portion, and a guide surface that is formed to intersect the support surface. The guide surface extends away from the end portion of the conductor in a direction opposite to a bent direction of a flatwise bent portion closest to the edgewise bent portion as it extends away from the supporting surface on an opposite side of a rotational axis.