发明授权
- 专利标题: Reducing gas supplying apparatus and method for manufacturing processed target object
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申请号: US16622245申请日: 2019-07-24
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公开(公告)号: US10933393B2公开(公告)日: 2021-03-02
- 发明人: Yutaka Matsumoto , Hiroshi Akama
- 申请人: ORIGIN COMPANY, LIMITED
- 申请人地址: JP Saitama
- 专利权人: ORIGIN COMPANY, LIMITED
- 当前专利权人: ORIGIN COMPANY, LIMITED
- 当前专利权人地址: JP Saitama
- 代理机构: Squire Patton Boggs (US) LLP
- 国际申请: PCT/JP2019/029017 WO 20190724
- 国际公布: WO2020/079909 WO 20200423
- 主分类号: B01J4/00
- IPC分类号: B01J4/00 ; B23K3/08 ; B01J4/02
摘要:
To provide a reducing gas supplying apparatus and a method for manufacturing a processed target object, which are capable of supplying a reducing liquid without causing it to scatter. The reducing gas supplying apparatus 1 includes a chamber 10 defining a space where soldering is performed on a target object T, a vaporizer 20 for generating a reducing gas FG to be supplied into the chamber 10 by receiving a reducing liquid FL to be converted into the reducing gas FG and vaporizing the reducing liquid FL, an intermediate container 30 for temporarily reserving the reducing liquid FL before the reducing liquid FL in a reducing liquid bottle 80 is introduced into the vaporizer 20, a transport tube 51, a supply tube 41, a transport part 58 for delivering the reducing liquid FL in the bottle 80 into the intermediate container 30, and a supply part 48 for delivering the reducing liquid FL in the intermediate container 30 into the vaporizer 20. The method includes supplying the object T into the chamber 10, performing soldering on the object T while supplying the reducing gas FG into the chamber 10, and taking the object T on which the soldering has been performed out of the chamber 10.
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