- 专利标题: Method for manufacturing an ultrathin heat dissipation structure
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申请号: US16455971申请日: 2019-06-28
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公开(公告)号: US10923411B2公开(公告)日: 2021-02-16
- 发明人: Ning Hou , Cong Lei , Biao Li , Ming-Jaan Ho
- 申请人: Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , GARUDA TECHNOLOGY CO., LTD
- 申请人地址: CN Shenzhen; CN Qinhuangdao; TW New Taipei
- 专利权人: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,GARUDA TECHNOLOGY CO., LTD
- 当前专利权人: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,GARUDA TECHNOLOGY CO., LTD
- 当前专利权人地址: CN Shenzhen; CN Qinhuangdao; TW New Taipei
- 代理机构: ScienBiziP, P.C.
- 优先权: CN201610302508 20160509
- 主分类号: B21D39/00
- IPC分类号: B21D39/00 ; B29L31/18 ; H01L23/373 ; H01L21/48 ; H01L23/427 ; H05K7/20
摘要:
A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.
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