A method of monitoring and controlling a sequential valve gate molding apparatus in an injection molding or other molding process is disclosed. The method includes creating a target strain profile, receiving a deviation limit, receiving a change in strain relating to a first valve gate from a first strain gauge, identifying whether a deviation exists from a first portion of the target strain profile based on the output from the first strain gauge, determining whether any existing deviation exceeds the deviation limit, and adjusting the position of a first valve gate pin in the first valve gate if it does. The method may further include control of subsequent valve gates. Multiple strain gauges may be used to control a single valve gate, and/or each strain gauge may control more than one valve gate.