- 专利标题: Surface modified dielectric refill structure
-
申请号: US16430926申请日: 2019-06-04
-
公开(公告)号: US10886168B2公开(公告)日: 2021-01-05
- 发明人: Chih-Chao Yang , Terry A. Spooner , Koichi Motoyama , Shyng-Tsong Chen
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Cantor Colburn LLP
- 代理商 Robert Sullivan
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L21/768 ; H01L23/522 ; H01L23/532
摘要:
Back end of line (BEOL) structures and methods generally includes forming at least two adjacent conductors separated by a space formed in a first dielectric material, wherein a liner layer is intermediate the first dielectric material and each of the at least two adjacent conductors. A second dielectric material in the space between the at least two adjacent conductors and in contact with the first dielectric material at a bottom surface thereof, wherein the first dielectric material is different from the second dielectric material, and wherein the first dielectric material has a nitrogen enriched surface at an interface between the first dielectric material and the second dielectric material. The nitrogen enriched surface can be formed by plasma nitridation, thermal nitridation, or laser annealing in the presence of nitrogen gas, ammonia, or a combination thereof.
信息查询
IPC分类: