Invention Grant
- Patent Title: Semiconductor device including vertical channel layer
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Application No.: US16526139Application Date: 2019-07-30
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Publication No.: US10854630B2Publication Date: 2020-12-01
- Inventor: Kwang-soo Kim , Yong-seok Kim , Tae-hun Kim , Min-kyung Bae , Jae-hoon Jang , Kohji Kanamori
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2017-0078589 20170621
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L29/08 ; H01L29/78 ; H01L27/11565

Abstract:
A semiconductor device includes a plurality of channel structures on a substrate, each channel structure extending in a first direction perpendicular to the substrate, a common source extension structure including a first semiconductor layer having an n-type conductivity and a gate insulating layer between the substrate and the channel structures, a plurality of gate electrodes on the common source extension structure and spaced apart from each other on a sidewall of each of the channel structures in the first direction, and a common source region on the substrate in contact with the common source extension structure and including a second semiconductor layer having an n-type conductivity. An upper portion of the common source extension structure has a first width, and a lower portion of the common source extension structure has a second width smaller than the first width.
Public/Granted literature
- US20190355744A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-11-21
Information query
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