- 专利标题: Electrolytic copper foil for graphene and method for producing the copper foil
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申请号: US16088840申请日: 2017-03-21
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公开(公告)号: US10826117B2公开(公告)日: 2020-11-03
- 发明人: Tae Jin Jo , Sun Hyoung Lee , Seul-Ki Park , Ki Deok Song
- 申请人: ILJIN MATERIALS CO., LTD.
- 申请人地址: KR Iksan
- 专利权人: ILJIN MATERIALS CO., LTD.
- 当前专利权人: ILJIN MATERIALS CO., LTD.
- 当前专利权人地址: KR Iksan
- 代理机构: Patent Office of Dr. Chung Park
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4a180ecd
- 国际申请: PCT/KR2017/003006 WO 20170321
- 国际公布: WO2017/188600 WO 20171102
- 主分类号: B21C37/02
- IPC分类号: B21C37/02 ; H01M10/0562 ; C25D3/38 ; C01B32/184 ; C25D1/04 ; C25D7/06 ; B82Y30/00 ; B82Y40/00
摘要:
The present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil. More particularly, the present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil, which may facilitate formation of graphene by blocking surface deformation during the electrolytic copper foil formation. In accordance with the present disclosure, the Rz roughness of the S-face of the electrolytic copper foil after 1 hour treatment at 200° C. in the synthesis of graphene on the electrolytic copper foil is defined based on the Relationship 1 below. This may also minimize the deformation of the surface of the electrolytic copper foil at high temperatures: 0.05≤(Rz roughness of M-face of electrolytic copper foil/Rz roughness of S-face after treatment at 200° C. for 1 hour)/thickness of electrolytic copper foil≤0.2. Relationship 1:
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