- 专利标题: LED lead frame structure
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申请号: US15942878申请日: 2018-04-02
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公开(公告)号: US10825973B2公开(公告)日: 2020-11-03
- 发明人: Chih-Kai Chang , Qiang Lee , Yao-Ching Huang
- 申请人: U.D.ELECTRONIC CORP. , U.D.(DONGGUAN) ELECTRONIC TECHNOLOGY CORP. , U.D.(ZHONG JIANG) ELECTRONIC CORP.
- 申请人地址: TW Taoyuan CN Dongguan CN Deyang
- 专利权人: U.D. ELECTRONIC CORP.,U.D. (DONGGUAN) ELECTRONIC TECHNOLOGY CORP.,U.D. (ZHONG JIANG) ELECTRONIC CORP.
- 当前专利权人: U.D. ELECTRONIC CORP.,U.D. (DONGGUAN) ELECTRONIC TECHNOLOGY CORP.,U.D. (ZHONG JIANG) ELECTRONIC CORP.
- 当前专利权人地址: TW Taoyuan CN Dongguan CN Deyang
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4505395
- 主分类号: H01L33/62
- IPC分类号: H01L33/62
摘要:
An LED lead frame structure includes a lamp body, and a stamped metal frame including transversely spaced and longitudinally extended first longitudinal frame portion and second longitudinal frame portion, longitudinally spaced and transversely extended first transverse frame portion and second transverse frame portion and a material strip frame. The first transverse frame portion is integrally connected to a rear end of the first longitudinal frame portion. The second transverse frame portions integrally connected to a rear end of the second longitudinal frame portion. This product can be regarded as a semi-finished product having a bendable structure and can be bent again if necessary, and thus, this design can reduce the number of times in bending lamp pins.
公开/授权文献
- US20180301607A1 LED LEAD FRAME STRUCTURE 公开/授权日:2018-10-18
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