- 专利标题: Semiconductor device with fin transistors and manufacturing method of such semiconductor device
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申请号: US16443319申请日: 2019-06-17
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公开(公告)号: US10811416B2公开(公告)日: 2020-10-20
- 发明人: Koichi Matsumoto
- 申请人: Sony Corporation
- 申请人地址: JP Tokyo
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Dentons US LLP
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5efdba6a
- 主分类号: H01L27/092
- IPC分类号: H01L27/092 ; H01L21/8238 ; H01L29/66 ; H01L29/49 ; H01L29/423 ; H01L29/417 ; H01L21/28 ; H01L29/06 ; H01L29/08 ; H01L29/51
摘要:
A semiconductor device and method of making same. The semiconductor device includes: a first conductivity type transistor and a second conductivity type transistor, wherein each of the first conductivity type transistor and the second conductivity type includes a gate insulating film formed on a base, a metal gate electrode formed on the gate insulating film, and side wall spacers formed at side walls of the metal gate electrode, wherein the gate insulating film is made of a high dielectric constant material, and wherein offset spacers are formed between the side walls of the metal gate electrode and the inner walls of the side wall spacers in any one of the first conductivity type transistor and the second conductivity type transistor, or offset spacers having different thicknesses are formed in the first conductivity type transistor and the second conductivity type transistor.
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