- 专利标题: Fluid flow tunnelling in a non-metallic computer chassis
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申请号: US16316975申请日: 2017-08-11
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公开(公告)号: US10809774B2公开(公告)日: 2020-10-20
- 发明人: Eliot Ahdoot
- 申请人: HYPERTECHNOLOGIE CIARA INC.
- 申请人地址: CA Saint-Laurent
- 专利权人: HYPERTECHNOLOGIE CIARA INC.
- 当前专利权人: HYPERTECHNOLOGIE CIARA INC.
- 当前专利权人地址: CA Saint-Laurent
- 代理机构: Benoit & Cote, Inc.
- 代理商 C. Marc Benoit; Charles-Andre Caron
- 国际申请: PCT/CA2017/050952 WO 20170811
- 国际公布: WO2018/027325 WO 20180215
- 主分类号: G06F1/20
- IPC分类号: G06F1/20 ; H05K7/20
摘要:
There is provided a chassis for a computing system comprising a heat-generating element. The chassis comprises a body with at least a portion thereof made of a non-metallic material, namely a nonmetallic portion. For example, the non-metallic material can be a moldable plastic. There is provided a channel made in the non-metallic portion, the channel having a starting point close to a dedicated location for a fan, the channel having an ending point close to a dedicated portion for the heat-generating element, the channel shaped to guide fluid propelled at the starting point to the ending point. The channel can be a tunnel inside the body or a valley on the surface of the body, and confines fluid flow from the fan, guiding the fluid flow to the heat-generating element.
公开/授权文献
- US20190317569A1 FLUID FLOW TUNNELLING IN A NON-METALLIC COMPUTER CHASSIS 公开/授权日:2019-10-17
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