Invention Grant
- Patent Title: Floating-bridge interconnects and methods of assembling same
-
Application No.: US16284218Application Date: 2019-02-25
-
Publication No.: US10796999B2Publication Date: 2020-10-06
- Inventor: Boon Ping Koh , Eng Huat Goh , Jiun Hann Sir , Khang Choong Yong , Min Suet Lim , Wil Choon Song
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@25ad038a
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L25/065 ; H01L25/00 ; H01L23/31 ; H01L23/498 ; H01L23/00

Abstract:
A semiconductor apparatus includes a floating-bridge interconnect that couples two semiconductive devices that are arranged across a middle semiconductive device. The floating-bridge interconnect can be semiconductive material such as a silicon bridge, or it can be an organic bridge. Computing functions required in one of the two semiconductive devices can be off-loaded to any of the floating-bridge interconnect or the other of the two semiconductive devices.
Public/Granted literature
- US20190304914A1 FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME Public/Granted day:2019-10-03
Information query
IPC分类: