Invention Grant
- Patent Title: CMOS image sensor having indented photodiode structure
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Application No.: US16017078Application Date: 2018-06-25
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Publication No.: US10790321B2Publication Date: 2020-09-29
- Inventor: Chia-Yu Wei , Hsin-Chi Chen , Kuo-Cheng Lee , Ping-Hao Lin , Hsun-Ying Huang , Yen-Liang Lin , Yu Ting Kao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
The present disclosure relates to a CMOS image sensor, and an associated method of formation. In some embodiments, the CMOS image sensor comprises a floating diffusion region disposed at one side of a transfer gate within a substrate and a photo detecting column disposed at the other side of the transfer gate opposing to the floating diffusion region within the substrate. The photo detecting column comprises a doped sensing layer with a doping type opposite to that of the substrate. The photo detecting column and the substrate are in contact with each other at a junction interface comprising one or more recessed portions. By forming the junction interface with recessed portions, the junction interface is enlarged compared to a previous p-n junction interface without recessed portions, and thus a full well capacity of the photodiode structure is improved.
Public/Granted literature
- US20190103428A1 CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE Public/Granted day:2019-04-04
Information query
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