Invention Grant
- Patent Title: Thin film inductor, power conversion circuit, and chip
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Application No.: US16559231Application Date: 2019-09-03
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Publication No.: US10790079B2Publication Date: 2020-09-29
- Inventor: Shijun Yang , Heqian Yang , Yongfa Zhu , Wei Chen
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agent James Anderson Harrison
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2bfa6e6f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5b2d3d56
- Main IPC: H01F27/245
- IPC: H01F27/245 ; H01F10/16 ; H01F41/32 ; H01L49/02 ; H02M3/158

Abstract:
A thin film inductor includes a first magnetic thin film and a second magnetic thin film that are adjacent, the first magnetic thin film is nested in the second magnetic thin film, and a relative magnetic permeability of the first magnetic thin film is less than a relative magnetic permeability of the second magnetic thin film, and a difference between the relative magnetic permeability of the first magnetic thin film and the relative magnetic permeability of the second magnetic thin film is greater than or equal to a first threshold, where when a magnetic induction intensity of the second magnetic thin film reaches a saturated magnetic induction intensity of the second magnetic thin film, a magnetic induction intensity of the first magnetic thin film is less than or equal to a saturated magnetic induction intensity of the first magnetic thin film.
Public/Granted literature
- US20200005985A1 Thin Film Inductor, Power Conversion Circuit, and Chip Public/Granted day:2020-01-02
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