- 专利标题: Cutting print substrates
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申请号: US16494967申请日: 2017-06-20
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公开(公告)号: US10787008B2公开(公告)日: 2020-09-29
- 发明人: Leticia Rubio , Xavier Quintero Ruiz , Utpal Kumar Sarkar
- 申请人: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 申请人地址: US TX Spring
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Spring
- 代理机构: HP Inc. Patent Department
- 国际申请: PCT/US2017/038275 WO 20170620
- 国际公布: WO2018/236348 WO 20181227
- 主分类号: B41J11/66
- IPC分类号: B41J11/66
摘要:
Print apparatus is controlled to execute a print operation comprising a plurality of print sweeps onto a print zone of a print substrate and a corresponding plurality of print advances of the print substrate between successive print sweeps. Print apparatus is controlled to execute an intermediate cutting operation between a pre-cut print sweep and a successive post-cut print sweep of the plurality of print sweeps.
公开/授权文献
- US20200009885A1 CUTTING PRINT SUBSTRATES 公开/授权日:2020-01-09
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