- 专利标题： Semiconductor device, communication system, and method of manufacturing semiconductor device
-
申请号： US15603468申请日： 2017-05-24
-
公开(公告)号： US10784587B2公开(公告)日： 2020-09-22
- 发明人: Hiroji Akahori
- 申请人： LAPIS Semiconductor Co., Ltd.
- 申请人地址： JP Yokohama
- 专利权人： LAPIS Semiconductor Co., Ltd.
- 当前专利权人： LAPIS Semiconductor Co., Ltd.
- 当前专利权人地址： JP Yokohama
- 代理机构： JCIPRNET
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@415d5370
- 主分类号： H01Q1/22
- IPC分类号： H01Q1/22 ; H01Q21/00 ; H01Q1/24 ; H01Q1/48 ; H01Q21/29
摘要：
A semiconductor device includes a semiconductor chip including a communication circuit, a first antenna element formed in a first rewiring layer covering a first surface of the semiconductor chip and connected to the communication circuit, and a second antenna element formed in a second rewiring layer covering a second surface on the side opposite to the first surface of the semiconductor chip and connected to the communication circuit.
公开/授权文献
信息查询
