- 专利标题： Compartment shielding for warpage improvement
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申请号： US15352527申请日： 2016-11-15
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公开(公告)号： US10784230B2公开(公告)日： 2020-09-22
- 发明人: Jenchun Chen
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaohsiung
- 专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Foley & Lardner LLP
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/552 ; H01L25/10 ; H01L21/56 ; H01L23/31
摘要：
A semiconductor device package comprises a substrate, a first component, a second component, a package body and a conductive material. The substrate has a surface. The first component is on the surface of the substrate. The second component is on the surface of the substrate. The package body comprises a first portion, a second portion and a third portion. The first portion encapsulates the first component and has a side surface. The second portion encapsulates the second component and has a side surface. The third portion connects the first portion and the second portion and has a top surface. The side surface of the first portion, the side surface of the second portion and the top surface of the third portion define a space separating the side surface of the first portion from the side surface of the second portion. The conductive material is disposed in the space.
公开/授权文献
- US20180138148A1 COMPARTMENT SHIELDING FOR WARPAGE IMPROVEMENT 公开/授权日：2018-05-17
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