发明授权
- 专利标题： Methods and apparatus for a semiconductor device having bi-material die attach layer
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申请号： US16443653申请日： 2019-06-17
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公开(公告)号： US10784188B2公开(公告)日： 2020-09-22
- 发明人: Rongwei Zhang , Vikas Gupta
- 申请人： TEXAS INSTRUMENTS INCORPORATED
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 代理商 Rose Alyssa Keagy; Charles A. Brill; Frank D. Cimino
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/00 ; H01L21/48
摘要：
Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.
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