- 专利标题： Wafer clamp and a method of clamping a wafer
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申请号： US16583112申请日： 2019-09-25
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公开(公告)号： US10784133B2公开(公告)日： 2020-09-22
- 发明人: Fang Wan Lu , Jui Tang Chang
- 申请人： Himax Technologies Limited
- 申请人地址： TW Tainan
- 专利权人： Himax Techologies Limited
- 当前专利权人： Himax Techologies Limited
- 当前专利权人地址： TW Tainan
- 代理机构： Stout, Uxa & Buyan, LLP
- 代理商 Donald E. Stout
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/687 ; H01L21/68 ; G01V8/14
摘要：
A wafer clamp includes a platform with a top surface, a stopper disposed at a front end of the platform, a push rod disposed at a rear end of the platform, at least one actuator pivotally connected to the push rod, and a sensor disposed at the front end of the platform, the sensor measuring a distance between the sensor and a wafer over the sensor.
公开/授权文献
- US20200020557A1 WAFER CLAMP AND A METHOD OF CLAMPING A WAFER 公开/授权日：2020-01-16
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