- 专利标题： Thermal interface material having different thicknesses in packages
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申请号： US15609206申请日： 2017-05-31
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公开(公告)号： US10770405B2公开(公告)日： 2020-09-08
- 发明人: Sung-Hui Huang , Da-Cyuan Yu , Kuan-Yu Huang , Pai Yuan Li , Hsiang-Fan Lee
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/00 ; H01L21/56 ; H01L23/31 ; H01L21/48 ; H01L23/367 ; H01L23/498 ; H01L25/065 ; H01L25/18 ; H01L25/00
摘要：
A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
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