Invention Grant
- Patent Title: Electrostatic discharge circuit and manufacturing method therefor, and display apparatus
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Application No.: US16320674Application Date: 2018-04-11
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Publication No.: US10756123B2Publication Date: 2020-08-25
- Inventor: Yang Li , Shuo Tang , Ying Meng , Bin Feng , Peng Sun
- Applicant: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Leason Ellis LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@75c57665
- International Application: PCT/CN2018/082694 WO 20180411
- International Announcement: WO2018/214662 WO 20181129
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L23/498 ; H01L23/60 ; H01L27/02 ; H01L23/522 ; H01L23/48 ; H01L21/768

Abstract:
An electrostatic discharge circuit and a manufacturing method therefor, and a display apparatus. The electrostatic discharge circuit includes: a base substrate; at least one first signal line located on the base substrate, at least one second signal line and a first isolation layer, wherein the at least one first signal line and the at least one second signal line are insulated from each other by the first isolation layer; and a second isolation layer covering the at least one second signal line, wherein a via hole is provided on the at least one first signal line, the via hole penetrates through the first isolation layer and the second isolation layer so that the at least one first signal line is located at the bottom of the via hole, and a part of the via hole is enclosed by the at least one second signal line.
Public/Granted literature
- US20190165000A1 ELECTROSTATIC DISCHARGE CIRCUIT AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS Public/Granted day:2019-05-30
Information query
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