An interconnection system includes a first support surface positionable against a respective first surface of a first printed circuit board (PCB) and a second support surface positionable against a respective first surface of a second PCB. The first PCB has a respective second surface spaced apart from the respective first surface by a first thickness. The second PCB has a respective second surface spaced apart from the respective first surface by a second thickness. A separator extends from the first support surface and from the second support surface. A contact pin extends through the separator. A portion of the contact pin extending in first direction from the separator is spaced apart from the first support surface by a distance corresponding to the first thickness. A portion of the contact pin extending in a second direction from the separator is spaced apart from the second support surface by the second thickness.