- 专利标题: Module board socket connector
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申请号: US15773862申请日: 2015-12-22
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公开(公告)号: US10707602B2公开(公告)日: 2020-07-07
- 发明人: Kevin B. Leigh , Sunil Ganta , John Norton
- 申请人: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- 申请人地址: US TX Houston
- 专利权人: Hewlett Packard Enterprise Development LP
- 当前专利权人: Hewlett Packard Enterprise Development LP
- 当前专利权人地址: US TX Houston
- 代理机构: Brooks, Cameron & Huebsch, PLLC
- 国际申请: PCT/US2015/067421 WO 20151222
- 国际公布: WO2017/111951 WO 20170629
- 主分类号: H01R12/70
- IPC分类号: H01R12/70 ; H01R13/64 ; H01R33/76 ; H01R12/71 ; H01R13/621 ; H01R24/00
摘要:
In one example, a system for a socket connector includes a first alignment feature with a first height to engage with a module board, wherein the first alignment feature horizontally aligns the module board with a socket, and a second alignment feature with a second height to engage with the module board, wherein the second alignment feature vertically aligns the module board with the socket.
公开/授权文献
- US20190157783A1 SOCKET CONNECTOR 公开/授权日:2019-05-23
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