- 专利标题: Light emitting diode and fabrication method thereof
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申请号: US16522634申请日: 2019-07-25
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公开(公告)号: US10707381B2公开(公告)日: 2020-07-07
- 发明人: Cheng Meng , Yuehua Jia , Jing Wang , Chun-Yi Wu , Ching-Shan Tao , Duxiang Wang
- 申请人: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- 申请人地址: CN Xiamen
- 专利权人: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- 当前专利权人: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- 当前专利权人地址: CN Xiamen
- 代理机构: Syncoda LLC
- 代理商 Feng Ma
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@37fdbf4f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4cfab87a com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@593527fb com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6131349e
- 主分类号: H01L33/42
- IPC分类号: H01L33/42 ; H01L33/40 ; H01L33/44 ; H01L33/38 ; H01L33/00 ; H01L33/30
摘要:
A light-emitting diode includes a light-emitting epitaxial laminated layer having a first surface and a second, opposing, surface, including an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer; an omnidirectional reflector structure formed on the second surface of the light-emitting epitaxial laminated layer, including a transparent dielectric layer located on the second surface of the light-emitting epitaxial laminated layer and having conductive holes therein; a first transparent adhesive layer on one side surface of the transparent dielectric layer that is distal from the light-emitting epitaxial laminated layer; a second transparent adhesive layer on one side surface of the first transparent adhesive layer that is distal from the transparent dielectric layer; and a metal reflective layer on one side surface of the second transparent adhesive layer that is distal from the first transparent adhesive layer.
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