Invention Grant
- Patent Title: Metal plate, patterning apparatus and patterning method using the same
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Application No.: US15852901Application Date: 2017-12-22
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Publication No.: US10702967B2Publication Date: 2020-07-07
- Inventor: Do Soo Sung , Sung Wook Kim , Jin O Kwak , Young Tae Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1ddcbfc5
- Main IPC: B24B21/04
- IPC: B24B21/04 ; B24B27/00 ; B24B21/00 ; B44C1/22 ; B24B19/02 ; B24B21/12 ; B24D11/04 ; B44C5/04 ; A47B96/20

Abstract:
Disclosed herein are a metal plate including a plurality of pattern portions, a patterning apparatus configured to form a plurality of patterns on the metal plate, and a patterning method using the same. The metal plate to be used in a household appliance includes a plurality of pattern portions in which a hairline pattern is formed on a surface of the metal plate, wherein the plurality of pattern portions includes a first pattern portion having a first hairline pattern and a second pattern portion having a second hairline pattern different from the first hairline pattern.
Public/Granted literature
- US20180178344A1 METAL PLATE, PATTERNING APPARATUS AND PATTERNING METHOD USING THE SAME Public/Granted day:2018-06-28
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