- 专利标题： Package with passive devices and method of forming the same
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申请号： US16532162申请日： 2019-08-05
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公开(公告)号： US10700032B2公开(公告)日： 2020-06-30
- 发明人: Shuo-Mao Chen , Der-Chyang Yeh , Li-Hsien Huang
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L23/522 ; H01L23/525 ; H01L21/56 ; H01L23/538 ; H01L21/768
摘要：
An embodiment is a device comprising a substrate, a metal pad over the substrate, and a passivation layer comprising a portion over the metal pad. The device further comprises a metal pillar over and electrically coupled to the metal pad, and a passive device comprising a first portion at a same level as the metal pillar, wherein the first portion of the passive device is formed of a same material as the metal pillar.
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