- 专利标题: Component mounting device
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申请号: US15812139申请日: 2017-11-14
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公开(公告)号: US10650543B2公开(公告)日: 2020-05-12
- 发明人: Kazushi Takama
- 申请人: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- 申请人地址: JP Shizuoka-ken
- 专利权人: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- 当前专利权人: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- 当前专利权人地址: JP Shizuoka-ken
- 代理机构: Studebaker & Brackett PC
- 主分类号: G06T7/00
- IPC分类号: G06T7/00 ; G06T7/60 ; H05K13/08
摘要:
A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging section capable of imaging the mounting position on the substrate, and a controller that determines a mounting state by comparing images of the mounting position before and after mounting of the component captured by the imaging section. The controller is configured to determine the mounting state by comparing the images before and after mounting of the component during operation from completion of mounting of the component to completion of mounting of a subsequent component.
公开/授权文献
- US20180070487A1 COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD 公开/授权日:2018-03-08
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