- 专利标题: Array substrate and fabricating method thereof
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申请号: US15550640申请日: 2017-02-28
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公开(公告)号: US10636817B2公开(公告)日: 2020-04-28
- 发明人: Seungjin Choi
- 申请人: BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址: CN Beijing
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址: CN Beijing
- 代理机构: Intellectual Valley Law, P.C.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5fda0450
- 国际申请: PCT/CN2017/075163 WO 20170228
- 国际公布: WO2018/014559 WO 20180125
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L21/77 ; H01L29/786
摘要:
The present application discloses an array substrate having a display area and a peripheral area. The array substrate includes a plurality of first thin film transistors respectively in a plurality of subpixels in the display area; and a plurality of second thin film transistors in the peripheral area, an oxygen content in active layers of the plurality of first thin film transistors being higher than that in active layers of the plurality of second thin film transistors.
公开/授权文献
- US10700097B2 Array substrate and fabricating method thereof 公开/授权日:2020-06-30
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