- 专利标题: Multilayer stack with enhanced conductivity and stability
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申请号: US16700291申请日: 2019-12-02
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公开(公告)号: US10607747B1公开(公告)日: 2020-03-31
- 发明人: Patrick J. Kinlen , Matthew A. Flack , Eric A. Bruton
- 申请人: The Boeing Company
- 申请人地址: US IL Chicago
- 专利权人: The Boeing Company
- 当前专利权人: The Boeing Company
- 当前专利权人地址: US IL Chicago
- 代理机构: McDonnell Boehnen Hulbert & Berghoff LLP
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; H01B1/12 ; H01C17/065 ; H01C17/24 ; H05B3/14 ; H01C17/26 ; H01C7/18 ; H01C1/16 ; H01B1/22 ; H01B1/24 ; H01B3/00 ; H01B7/02 ; H01C7/00 ; B64D45/02 ; H01C7/02 ; H01C17/28 ; B64D15/12 ; H01C1/142
摘要:
An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
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