- 专利标题： Semiconductor assembly
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申请号： US16073008申请日： 2016-01-26
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公开(公告)号： US10588234B2公开(公告)日： 2020-03-10
- 发明人: Kevin B. Leigh , George D. Megason
- 申请人： Hewlett Packard Enterprise Development LP
- 申请人地址： US TX Houston
- 专利权人： Hewlett Packard Enterprise Development LP
- 当前专利权人： Hewlett Packard Enterprise Development LP
- 当前专利权人地址： US TX Houston
- 代理机构： Hewlett Packard Enterprise Patent Department
- 国际申请： PCT/US2016/014927 WO 20160126
- 国际公布： WO2017/131638 WO 20170803
- 主分类号： H01R12/00
- IPC分类号： H01R12/00 ; H05K7/10 ; H05K7/20 ; H01L23/32 ; H01R12/71
摘要：
An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.
公开/授权文献
- US20190045650A1 SEMICONDUCTOR ASSEMBLY 公开/授权日：2019-02-07
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