Invention Grant
- Patent Title: Loudspeaker module
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Application No.: US15572142Application Date: 2015-11-18
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Publication No.: US10582279B2Publication Date: 2020-03-03
- Inventor: Yun Yang , Dan Han
- Applicant: GOERTEK INC.
- Applicant Address: CN Weifang
- Assignee: Goertek Inc.
- Current Assignee: Goertek Inc.
- Current Assignee Address: CN Weifang
- Priority: CN201510240603 20150512
- International Application: PCT/CN2015/094899 WO 20151118
- International Announcement: WO2016/179997 WO 20161117
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R1/06 ; H04R3/00 ; H04R1/28 ; H04R9/06 ; H04R31/00

Abstract:
Disclosed is a loudspeaker module, comprising a module housing and a single loudspeaker; a module inner cavity configured to receive the single loudspeaker is formed in the module housing; and the module housing comprises a module upper housing and a module lower housing, the module upper housing is arranged at the outer side of a front cover of the single loudspeaker, the module upper housing is provided with a metal sheet in an injection molding manner, and a grounding terminal configured to be in grounding connection with an application terminal of the loudspeaker module is led out from the metal sheet. The loudspeaker module of the present invention not only is aiding in thinning, but also can ensure the matching stability between a loudspeaker and an application terminal.
Public/Granted literature
- US20180132018A1 LOUDSPEAKER MODULE Public/Granted day:2018-05-10
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