Invention Grant
- Patent Title: Modular electronics apparatuses and methods
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Application No.: US15536278Application Date: 2015-11-23
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Publication No.: US10573835B2Publication Date: 2020-02-25
- Inventor: Mark Allen , Yinglin Liu , Markku Rouvala , Surama Malik
- Applicant: Nokia Technologies Oy
- Applicant Address: FI Espoo
- Assignee: Nokia Technologies Oy
- Current Assignee: Nokia Technologies Oy
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Priority: EP14199801 20141222
- International Application: PCT/FI2015/050813 WO 20151123
- International Announcement: WO2016/102747 WO 20160630
- Main IPC: H01L51/05
- IPC: H01L51/05 ; H01L51/00 ; H01L27/28 ; H01L27/12 ; H01L51/50 ; H01L29/49 ; C09J9/02 ; C09J131/04 ; C09J171/02 ; H01G11/08 ; H01G11/86 ; H01L23/00 ; H01M10/04 ; H01M10/42 ; H01G11/56
Abstract:
An apparatus comprising: a module; a substrate; and electrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as the adhesive to attach the module to the substrate.
Public/Granted literature
- US20180013082A1 MODULAR ELECTRONICS APPARATUSES AND METHODS Public/Granted day:2018-01-11
Information query
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