Invention Grant
- Patent Title: Cooling device
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Application No.: US15656711Application Date: 2017-07-21
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Publication No.: US10571161B2Publication Date: 2020-02-25
- Inventor: Junsoo Kim , Jungyun Kwon , Seungeon Moon , Seung Min Lee , Jaewoo Lee , Solyee Im
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2016-0142205 20161028; KR10-2017-0042091 20170331
- Main IPC: F25B19/00
- IPC: F25B19/00 ; F25B39/02 ; F25B41/04 ; F16K31/00 ; F16K99/00

Abstract:
Provided is a cooling device including a valve structure including a temperature-responsive material that changes in volume in response to changes in temperature, a supporting structure, which is joined to the valve structure and supports the valve structure, and a solvent which contacts the valve structure, wherein a portion of the solvent contacts the valve structure and another portion of the solvent is externally exposed, the valve structure changes in volume in response to changes in temperature and thereby regulating the externally exposed surface area of the solvent.
Public/Granted literature
- US20180119999A1 COOLING DEVICE Public/Granted day:2018-05-03
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