- 专利标题: Isolation module for use between power rails in an integrated circuit
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申请号: US15670740申请日: 2017-08-07
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公开(公告)号: US10560094B2公开(公告)日: 2020-02-11
- 发明人: Fern Nee Tan , Sanjiv Soman , Alexander Levin , Srinivasan Rajagopalan
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 主分类号: H03K3/012
- IPC分类号: H03K3/012 ; H03K19/003 ; H01L23/64 ; H01L23/00
摘要:
An integrated circuit (IC) can include multiple power domains that are served by a common power source. In an example, a first IC power rail can be coupled to the source and a first consumer circuit. A second IC power rail can be coupled to a second consumer circuit. The second IC power rail can receive a filtered power signal from an isolation module that is coupled between the first and second power rails. In an example, an isolation module includes an integrated inductor and a capacitor (e.g., a land-side capacitor). The integrated inductor can optionally include multiple spaced apart conductive layers that are electrically coupled. The integrated inductor can optionally include a series of conductive traces and plated through holes or vias that together provide a current path with multiple turns.
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