A light-emitting device package according to an embodiment may include a body; N (herein, N denotes a positive integer of 5 or more) upper pads disposed on the body to be spaced apart from each other; N−1 light-emitting device chips respectively arranged on N−1 upper pads among the N upper pads; and a plurality of first wires for electrically connecting the N−1 light-emitting device chips and the N upper pads to each other by at least one of a plurality of wiring structures.