- 专利标题: Semiconductor device and manufacturing method thereof
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申请号: US15584264申请日: 2017-05-02
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公开(公告)号: US10559695B2公开(公告)日: 2020-02-11
- 发明人: Shunpei Yamazaki , Hidekazu Miyairi , Akiharu Miyanaga , Kengo Akimoto , Kojiro Shiraishi
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 申请人地址: JP Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office
- 代理商 Eric J. Robinson
- 优先权: JP2008-197137 20080731
- 主分类号: H01L29/786
- IPC分类号: H01L29/786 ; H01L29/423 ; H01L29/66 ; H01L27/12
摘要:
To offer a semiconductor device including a thin film transistor having excellent characteristics and high reliability and a method for manufacturing the semiconductor device without variation. The summary is to include an inverted-staggered (bottom-gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used for a semiconductor layer and a buffer layer is provided between the semiconductor layer and source and drain electrode layers. An ohmic contact is formed by intentionally providing a buffer layer containing In, Ga, and Zn and having a higher carrier concentration than the semiconductor layer between the semiconductor layer and the source and drain electrode layers.
公开/授权文献
- US20170236943A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2017-08-17
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