发明授权
- 专利标题： Circuit package
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申请号： US15763865申请日： 2015-11-16
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公开(公告)号： US10559512B2公开(公告)日： 2020-02-11
- 发明人: Chien-Hua Chen , Michael W. Cumbie , Stephen Farrar
- 申请人： Hewlett-Packard Development Company, L.P.
- 申请人地址： US TX Spring
- 专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人地址： US TX Spring
- 代理机构： HP Inc. Patent Department
- 国际申请： PCT/US2015/060841 WO 20151116
- 国际公布： WO2017/086913 WO 20170526
- 主分类号： B41J2/14
- IPC分类号： B41J2/14 ; H01L23/31 ; H01L21/56 ; H01L23/29
摘要：
A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.
公开/授权文献
- US20180269125A1 CIRCUIT PACKAGE 公开/授权日：2018-09-20
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