An electronic device includes a molded frame, a core, a coil and a plurality of leads. The molded frame includes central winding bobbin and first and second lateral supports extending laterally outward therefrom. Each of the first and second lateral supports includes a top surface and first and second lower surfaces. The core is disposed about the coil and is supported on the top surfaces of the first and second lateral supports. The leads are formed of conductive material and are molded in the first and second lateral supports. Each of the leads includes a first end portion extending downward from the first lower surface a lateral support, and a second end portion extending along a second lower surface the lateral support. The second lower surface is lower than the first lower surface. The coil is wound about the central winding bobbin. A first end of the coil is affixed to the first end portion of a lead, and a second end of the coil is affixed to the first end portion of another lead.