- 专利标题： Method for producing a foil arrangement and corresponding foil arrangement
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申请号： US15314524申请日： 2015-05-27
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公开(公告)号： US10548229B2公开(公告)日： 2020-01-28
- 发明人: Johannes Bock , Andreas Rebelein , Andreas Schulze , Andreas Voegerl
- 申请人： CONTI TEMIC MICROELECTRONIC GMBH
- 申请人地址： DE Nuremberg
- 专利权人： Conti Temic microelectronic GmbH
- 当前专利权人： Conti Temic microelectronic GmbH
- 当前专利权人地址： DE Nuremberg
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- 优先权： DE102014210483 20140603
- 国际申请： PCT/EP2015/061709 WO 20150527
- 国际公布： WO2015/185412 WO 20151210
- 主分类号： B21C37/00
- IPC分类号： B21C37/00 ; H05K3/46 ; C25D3/12 ; C25D3/30 ; C25D3/48 ; C25D3/56 ; C25D3/60 ; C25D3/62 ; C25D7/06 ; H05K3/24 ; H05K3/28 ; H05K1/02
摘要：
A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.
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