A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.