- 专利标题: Nanosheet FET including all-around source/drain contact
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申请号: US15868742申请日: 2018-01-11
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公开(公告)号: US10546957B2公开(公告)日: 2020-01-28
- 发明人: Peng Xu , Chun Wing Yeung , Chen Zhang
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 代理机构: Cantor Colburn LLP
- 代理商 Vazken Alexanian
- 主分类号: H01L29/786
- IPC分类号: H01L29/786 ; H01L29/06 ; H01L29/423 ; H01L29/417 ; H01L29/66 ; H01L21/02 ; H01L21/306 ; H01L21/768
摘要:
A semiconductor device includes a semiconductor wafer having one or more suspended nanosheet extending between first and second source/drain regions. A gate structure wraps around the nanosheet stack to define a channel region located between the source/drain regions. The semiconductor device further includes a first all-around source/drain contact formed in the first source/drain region and a second all-around source/drain contact formed in the second source/drain region. The first and second all-around source/drain contacts each include a source/drain epitaxy structure and an electrically conductive external portion that encapsulates the source/drain epitaxy structure.
公开/授权文献
- US20190214502A1 NANOSHEET FET INCLUDING ALL-AROUND SOURCE/DRAIN CONTACT 公开/授权日:2019-07-11
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