Fabrication of a circuit board is facilitated by automatically determining an optimized power plane shape for a power plane of the circuit board, including ascertaining for the power plane a source location(s) and a sink location(s), where the source supplies power to the sink across the power plane. A center of current density is determined for the power plane shape, and a respective power plane sub-shape is incrementally generated between the center of current density and each source and sink location to, in part, supply a desired operational voltage from the source location(s) to the sink location(s) across the power plane. The respective power plane sub-shapes are combined into the optimized power plane shape. Further, the process includes initiating fabricating of the circuit board using, at least in part, the optimized power plane shape to provide the power plane shape within the circuit board.