发明授权
- 专利标题： Stitched devices
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申请号： US15402166申请日： 2017-01-09
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公开(公告)号： US10535645B2公开(公告)日： 2020-01-14
- 发明人: Wei Shao , Juan Boon Tan , Wei Liu , Wanbing Yi
- 申请人： GLOBALFOUNDRIES Singapore Pte. Ltd.
- 申请人地址： CA Ottawa
- 专利权人： ALSEPHINA INNOVATIONS INC.
- 当前专利权人： ALSEPHINA INNOVATIONS INC.
- 当前专利权人地址： CA Ottawa
- 代理机构： Thompson Hine LLP
- 主分类号： H01L27/02
- IPC分类号： H01L27/02 ; H01L21/48 ; H01L21/76 ; H01L23/49 ; H01L21/768 ; H01L23/528 ; H01L23/498 ; H01L23/522 ; H01L23/00 ; H01L25/065 ; H01L25/00
摘要：
A stitched device is disclosed. The stitched device includes first and second base devices having first and second stitched interconnects electrically coupled in a stitching level. This enables a single substrate of the stitched device to have electrically coupled first and second base devices.
公开/授权文献
- US20170125396A1 STITCHED DEVICES 公开/授权日：2017-05-04
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