- 专利标题： Wire bonding systems and related methods
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申请号： US16131401申请日： 2018-09-14
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公开(公告)号： US10535623B2公开(公告)日： 2020-01-14
- 发明人: Wentao Qin , Gordon M. Grivna , Harold Anderson , Thomas Anderson , George Chang
- 申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 申请人地址： US AZ Phoenix
- 专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人地址： US AZ Phoenix
- 代理机构： Adam R. Stephenson, Ltd.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.
公开/授权文献
- US20190013290A1 WIRE BONDING SYSTEMS AND RELATED METHODS 公开/授权日：2019-01-10
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