- 专利标题： Semiconductor package and manufacturing method thereof
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申请号： US15936877申请日： 2018-03-27
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公开(公告)号： US10535620B2公开(公告)日： 2020-01-14
- 发明人: Jong Sik Paek , No Sun Park
- 申请人： Amkor Technology, Inc.
- 申请人地址： US AZ Tempe
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 当前专利权人地址： US AZ Tempe
- 代理机构： McAndrews, Held & Malloy, Ltd.
- 优先权： KR10-2014-0172090 20141203
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L25/065
摘要：
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.
公开/授权文献
- US20180240768A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF 公开/授权日：2018-08-23
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